M27V256-90B6 vs IS27LV256-90PL feature comparison

M27V256-90B6 STMicroelectronics

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IS27LV256-90PL Integrated Silicon Solution Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS INTEGRATED SILICON SOLUTION INC
Part Package Code DIP QFJ
Package Description DIP, DIP28,.6 PLASTIC, LCC-32
Pin Count 28 32
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 90 ns 90 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T28 R-PQCC-J32
JESD-609 Code e0 e0
Length 37.085 mm 13.97 mm
Memory Density 262144 bit 262144 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 32
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP28,.6 LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.75 V 12.5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 3.55 mm
Standby Current-Max 0.00001 A 0.00002 A
Supply Current-Max 0.01 mA 0.008 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm 11.43 mm
Base Number Matches 1 1

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Compare IS27LV256-90PL with alternatives