27C64MQ25
vs
AM27C64-255DIB
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
,
|
DIP, DIP28,.6
|
Pin Count |
28
|
28
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
EAR99
|
HTS Code |
8542.32.00.61
|
8542.32.00.61
|
Access Time-Max |
250 ns
|
250 ns
|
JESD-30 Code |
R-GDIP-T28
|
R-CDIP-T28
|
Memory Density |
65536 bit
|
65536 bit
|
Memory IC Type |
UVPROM
|
UVPROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Number of Words |
8192 words
|
8192 words
|
Number of Words Code |
8000
|
8000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Organization |
8KX8
|
8KX8
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
4
|
4
|
Rohs Code |
|
No
|
I/O Type |
|
COMMON
|
JESD-609 Code |
|
e0
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
DIP28,.6
|
Programming Voltage |
|
12.75 V
|
Standby Current-Max |
|
0.0001 A
|
Supply Current-Max |
|
0.025 mA
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare 27C64MQ25 with alternatives
Compare AM27C64-255DIB with alternatives