27C256MQG/B20
vs
CY27C256-200WC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
ATMEL GRENOBLE
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
CERAMIC, DIP-28
0.600 INCH, WINDOWED, CERDIP-28
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
200 ns
200 ns
JESD-30 Code
R-GDIP-T28
R-GDIP-T28
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
NFC 96883 Class G
Supply Current-Max
0.1 mA
0.045 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Pbfree Code
Rohs Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare 27C256MQG/B20 with alternatives
Compare CY27C256-200WC with alternatives