27C1024MEQ15 vs M27C1024-70XF6 feature comparison

27C1024MEQ15 Teledyne e2v

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M27C1024-70XF6 STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ATMEL GRENOBLE STMICROELECTRONICS
Part Package Code LCC DIP
Package Description , WINDOWED, FRIT SEALED, CERAMIC, DIP-40
Pin Count 44 40
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 150 ns 70 ns
JESD-30 Code S-CQCC-N44 R-GDIP-T40
Memory Density 1048576 bit 1048576 bit
Memory IC Type UVPROM UVPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 40
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 64KX16 64KX16
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.015 mA 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position QUAD DUAL
Base Number Matches 1 2
Rohs Code Yes
I/O Type COMMON
JESD-609 Code e3
Length 52.195 mm
Output Characteristics 3-STATE
Package Code WDIP
Package Equivalence Code DIP40,.6
Seated Height-Max 5.97 mm
Standby Current-Max 0.0001 A
Terminal Finish MATTE TIN
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare 27C1024MEQ15 with alternatives

Compare M27C1024-70XF6 with alternatives