25AA1024-I/P
vs
XC1701LPDG8C
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
XILINX INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
ROHS COMPLIANT, PLASTIC, DIP-8
|
LEAD FREE, PLASTIC, DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
200 YEARS OF DATA RETENTION; 1000000 ENDURANCE CYCLES/WORD
|
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
| Clock Frequency-Max (fCLK) |
20 MHz
|
15 MHz
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
9.27 mm
|
9.3599 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
EEPROM
|
CONFIGURATION MEMORY
|
| Memory Width |
8
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
131072 words
|
1048576 words
|
| Number of Words Code |
128000
|
1000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128KX8
|
1MX1
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
250
|
| Power Supplies |
2/5 V
|
3.3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.33 mm
|
4.5974 mm
|
| Serial Bus Type |
SPI
|
|
| Standby Current-Max |
0.000001 A
|
0.00005 A
|
| Supply Current-Max |
0.01 mA
|
0.01 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Type |
NOR TYPE
|
|
| Width |
7.62 mm
|
7.62 mm
|
| Write Cycle Time-Max (tWC) |
6 ms
|
|
| Write Protection |
HARDWARE/SOFTWARE
|
|
| Base Number Matches |
3
|
2
|
| I/O Type |
|
COMMON
|
| Moisture Sensitivity Level |
|
1
|
| Output Characteristics |
|
3-STATE
|
|
|
|
Compare 25AA1024-I/P with alternatives
Compare XC1701LPDG8C with alternatives