24LC32AF-E/MNY
vs
24LC32AXT-E/CS16K
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DFN
BGA
Package Description
2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8
ROHS COMPLIANT, CSP-5
Pin Count
8
5
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Samacsys Manufacturer
Microchip
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
JESD-30 Code
R-PDSO-N8
R-PBGA-B5
JESD-609 Code
e4
Length
3 mm
Memory Density
32768 bit
32768 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
5
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4KX8
4KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
0.8 mm
0.55 mm
Serial Bus Type
I2C
I2C
Supply Current-Max
0.003 mA
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.5 V
2.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
BALL
Terminal Pitch
0.5 mm
0.285 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
2 mm
Write Cycle Time-Max (tWC)
5 ms
5 ms
Base Number Matches
1
1
Additional Feature
2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED
Data Retention Time-Min
200
Compare 24LC32AF-E/MNY with alternatives
Compare 24LC32AXT-E/CS16K with alternatives