Part Details for 24LC32AF-E/MNY by Microchip Technology Inc
Overview of 24LC32AF-E/MNY by Microchip Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Security and Surveillance
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Energy and Power Systems
Part Details for 24LC32AF-E/MNY
24LC32AF-E/MNY CAD Models
24LC32AF-E/MNY Part Data Attributes
|
|
24LC32AF-E/MNY
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
24LC32AF-E/MNY
Microchip Technology Inc
4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Part Package Code | DFN | |
| Package Description | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Microchip | |
| Clock Frequency-Max (fCLK) | 0.4 MHz | |
| JESD-30 Code | R-PDSO-N8 | |
| JESD-609 Code | e4 | |
| Length | 3 mm | |
| Memory Density | 32768 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.8 mm | |
| Serial Bus Type | I2C | |
| Supply Current-Max | 0.003 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 2.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 2 mm | |
| Write Cycle Time-Max (tWC) | 5 ms |
Alternate Parts for 24LC32AF-E/MNY
This table gives cross-reference parts and alternative options found for 24LC32AF-E/MNY. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 24LC32AF-E/MNY, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 24LC32AFT-E/MNY | 4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | Microchip Technology Inc | 24LC32AF-E/MNY vs 24LC32AFT-E/MNY |
| 24LC32AFT-I/MNY | 4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | Microchip Technology Inc | 24LC32AF-E/MNY vs 24LC32AFT-I/MNY |