24AA08-E/MC
vs
M24C08-BN3G
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
STMICROELECTRONICS
Part Package Code
DFN
DIP
Package Description
VSON, SOLCC8,.11,20
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
compliant
compliant
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
Data Retention Time-Min
200
40
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
I2C Control Byte
1010XMMR
1010DMMR
JESD-30 Code
R-PDSO-N8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
3 mm
9.27 mm
Memory Density
8192 bit
8192 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
1
NOT APPLICABLE
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1KX8
1KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
DIP
Package Equivalence Code
SOLCC8,.11,20
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Power Supplies
2/5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
5.33 mm
Serial Bus Type
I2C
I2C
Standby Current-Max
0.000001 A
0.000005 A
Supply Current-Max
0.003 mA
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.7 V
4.5 V
Supply Voltage-Nom (Vsup)
2.5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
2 mm
7.62 mm
Write Cycle Time-Max (tWC)
5 ms
10 ms
Write Protection
HARDWARE
HARDWARE
Base Number Matches
1
1
Screening Level
AEC-Q100
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