M24C08-BN3G
vs
M24C08-BN3P/W
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
DIP, DIP8,.3
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
compliant
compliant
Clock Frequency-Max (fCLK)
0.4 MHz
0.4 MHz
Data Retention Time-Min
40
40
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
I2C Control Byte
1010DMMR
1010DMMR
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
9.27 mm
9.27 mm
Memory Density
8192 bit
8192 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Moisture Sensitivity Level
NOT APPLICABLE
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1KX8
1KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
5.33 mm
5.33 mm
Serial Bus Type
I2C
I2C
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.003 mA
0.003 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
10 ms
10 ms
Write Protection
HARDWARE
HARDWARE
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8542.32.00.51
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