23LC512-E/P vs 23LCV512T-I/ST feature comparison

23LC512-E/P Microchip Technology Inc

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23LCV512T-I/ST Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description DIP-8 TSSOP-8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Factory Lead Time 6 Weeks 7 Weeks
Samacsys Manufacturer Microchip Microchip
Clock Frequency-Max (fCLK) 16 MHz 20 MHz
I/O Type SEPARATE COMMON
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e3 e3
Length 9.271 mm 4.4 mm
Memory Density 524288 bit 524288 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 8 8
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX8 64KX8
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP8,.3 TSSOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Screening Level TS 16949
Seated Height-Max 5.334 mm 1.2 mm
Standby Current-Max 0.00002 A 0.00001 A
Standby Voltage-Min 2.5 V 2.5 V
Supply Current-Max 0.01 mA 0.01 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3 mm
Base Number Matches 1 1
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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Compare 23LCV512T-I/ST with alternatives