2308-2HPGGI
vs
CY2308SXI-3T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
TSSOP
SOIC
Package Description
TSSOP-16
SOIC-16
Pin Count
16
16
Manufacturer Package Code
PGG16
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.31.00.01
Family
2308
2308
Input Conditioning
MUX
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e3
e4
Length
5 mm
9.893 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.012 A
0.008 A
Moisture Sensitivity Level
1
3
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
16
16
Number of True Outputs
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.2 ns
0.2 ns
Seated Height-Max
1.2 mm
1.727 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Width
4.4 mm
3.8985 mm
fmax-Min
133.3 MHz
133.3 MHz
Base Number Matches
2
2
ECCN Code
EAR99
Technology
CMOS
Compare 2308-2HPGGI with alternatives
Compare CY2308SXI-3T with alternatives