2308-2HPGGI vs 2308B-1HPGI8 feature comparison

2308-2HPGGI Integrated Device Technology Inc

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2308B-1HPGI8 Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP TSSOP
Package Description TSSOP-16 TSSOP, TSSOP16,.25
Pin Count 16 16
Manufacturer Package Code PGG16
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 2308 2308
Input Conditioning MUX STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e3 e0
Length 5 mm 5 mm
Logic IC Type PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
Max I(ol) 0.012 A 0.012 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 16 16
Number of True Outputs 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP16,.25 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 240
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.2 ns 0.2 ns
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN Tin/Lead (Sn85Pb15)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 20
Width 4.4 mm 4.4 mm
fmax-Min 133.3 MHz 133.3 MHz
Base Number Matches 2 1
Technology CMOS

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Compare 2308B-1HPGI8 with alternatives