2305NZ-1HDCG8
vs
PL123-09HOCA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
Package Description
SOIC-8
TSSOP, TSSOP16,.25
Pin Count
8
Manufacturer Package Code
DCG8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
2305
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-PDSO-G8
R-PDSO-G16
JESD-609 Code
e3
Length
4.9 mm
5 mm
Logic IC Type
LOW SKEW CLOCK DRIVER
LOW SKEW CLOCK DRIVER
Max I(ol)
0.012 A
0.012 A
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
8
16
Number of True Outputs
5
9
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSOP
TSSOP
Package Equivalence Code
SOP8,.25
TSSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
8.7 ns
0.35 ns
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.25 ns
0.25 ns
Seated Height-Max
1.55 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
4.4 mm
Base Number Matches
1
2
Load Capacitance (CL)
30 pF
Packing Method
TUBE
Power Supply Current-Max (ICC)
32 mA
Prop. Delay@Nom-Sup
8.5 ns
Technology
CMOS
fmax-Min
10 MHz
Compare 2305NZ-1HDCG8 with alternatives
Compare PL123-09HOCA with alternatives