2305MI-1HLF vs SNCDC351DB feature comparison

2305MI-1HLF Integrated Device Technology Inc

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SNCDC351DB Texas Instruments

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC TEXAS INSTRUMENTS INC
Part Package Code SOIC
Package Description 0.150 INCH, LEAD FREE, SOIC-8 SSOP,
Pin Count 8
Manufacturer Package Code DCG8
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family 2305 ABT
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G8 R-PDSO-G24
JESD-609 Code e3
Length 4.9 mm 8.2 mm
Logic IC Type PLL BASED CLOCK DRIVER LOW SKEW CLOCK DRIVER
Max I(ol) 0.012 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 8 24
Number of True Outputs 4 10
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.25 ns 0.5 ns
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS BICMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 5.3 mm
fmax-Min 133 MHz
Base Number Matches 2 1
Additional Feature MAX PART TO PART SKEW = 1NS
Load Capacitance (CL) 50 pF

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