21281EB
vs
IDT79RC32V364-100DA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
LFQFP, QFP144,.87SQ,20
LFQFP, QFP144,.87SQ,20
Pin Count
144
144
Reach Compliance Code
unknown
compliant
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
233 MHz
50 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
YES
JESD-30 Code
S-PQFP-G144
S-PQFP-G144
Length
20 mm
20 mm
Low Power Mode
YES
YES
Number of Terminals
144
144
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Equivalence Code
QFP144,.87SQ,20
QFP144,.87SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Power Supplies
2,3.3 V
3.3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.6 mm
Speed
233 MHz
100 MHz
Supply Voltage-Max
1.815 V
3.465 V
Supply Voltage-Min
1.485 V
3.135 V
Supply Voltage-Nom
1.65 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
OTHER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
20 mm
20 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
9
Rohs Code
JESD-609 Code
e0
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Supply Current-Max
300 mA
Technology
CMOS
Terminal Finish
Tin/Lead (Sn85Pb15)
Time@Peak Reflow Temperature-Max (s)
30
Compare 21281EB with alternatives
Compare IDT79RC32V364-100DA with alternatives