21281EB
vs
SCF5250LAG100
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
NXP SEMICONDUCTORS
Part Package Code
QFP
Package Description
LFQFP, QFP144,.87SQ,20
20 X 20 MM, 1.40 MM THICKNESS, 0.50 MM PITCH, LEAD FREE, QFP-144
Pin Count
144
Reach Compliance Code
unknown
compliant
Address Bus Width
32
25
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
233 MHz
33.86 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
YES
JESD-30 Code
S-PQFP-G144
S-PQFP-G144
Length
20 mm
20 mm
Low Power Mode
YES
YES
Number of Terminals
144
144
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Equivalence Code
QFP144,.87SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Power Supplies
2,3.3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.6 mm
Speed
233 MHz
100 MHz
Supply Voltage-Max
1.815 V
1.32 V
Supply Voltage-Min
1.485 V
1.08 V
Supply Voltage-Nom
1.65 V
1.2 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
20 mm
20 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
2
Rohs Code
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Factory Lead Time
4 Weeks
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code
e3
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Technology
CMOS
Terminal Finish
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
40
Compare 21281EB with alternatives
Compare SCF5250LAG100 with alternatives