1SS355-H
vs
S-L1SS400BST3G
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
FORMOSA MICROSEMI CO LTD
|
LESHAN RADIO CO LTD
|
| Package Description |
HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-2
|
R-PBCC-N2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Additional Feature |
HIGH RELIABILITY
|
HIGH RELIABILITY
|
| Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
R-PDSO-G2
|
R-PBCC-N2
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Current-Max |
0.1 A
|
0.1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Dissipation-Max |
0.225 W
|
|
| Rep Pk Reverse Voltage-Max |
90 V
|
90 V
|
| Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
10
|
| Base Number Matches |
1
|
1
|
| Forward Voltage-Max (VF) |
|
1.2 V
|
| Non-rep Pk Forward Current-Max |
|
0.5 A
|
| Reference Standard |
|
AEC-Q101
|
| Reverse Current-Max |
|
0.1 µA
|
| Reverse Test Voltage |
|
80 V
|
|
|
|
Compare 1SS355-H with alternatives
Compare S-L1SS400BST3G with alternatives