1PS70SB82,115
vs
HSMS-2825-BLK
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
BROADCOM INC
|
| Part Package Code |
SC-70
|
|
| Package Description |
PLASTIC, SC-70, 3 PIN
|
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
SOT323
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8541.10.00.70
|
8541.10.00.60
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
MIXER DIODE
|
MIXER DIODE
|
| Forward Voltage-Max (VF) |
0.7 V
|
0.34 V
|
| Frequency Band |
ULTRA HIGH FREQUENCY
|
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G4
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
2
|
| Number of Terminals |
3
|
4
|
| Operating Temperature-Max |
125 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
15 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| Operating Temperature-Min |
|
-65 °C
|
| Reverse Current-Max |
|
0.1 µA
|
| Reverse Test Voltage |
|
1 V
|
|
|
|
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