1N825-1 vs 1N825 feature comparison

1N825-1 Microsemi Corporation

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1N825 STMicroelectronics

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP STMICROELECTRONICS
Part Package Code DO-7
Package Description DO-35, 2 PIN
Pin Count 2
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Samacsys Manufacturer Microsemi Corporation
Additional Feature METALLURGICALLY BONDED TEMPERATURE COMPENSATED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 15 Ω 15 Ω
JEDEC-95 Code DO-204AH
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Power Dissipation-Max 0.5 W 0.4 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500
Reference Voltage-Nom 6.2 V 6.2 V
Reverse Current-Max 2 µA
Reverse Test Voltage 3 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 0.124 mV/°C 0.124 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 7.5 mA 7.5 mA
Base Number Matches 17 4

Compare 1N825-1 with alternatives

Compare 1N825 with alternatives