1N821AE3
vs
1N821136
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NXP SEMICONDUCTORS
Package Description
HERMETIC SEALED, GLASS, DO-7, 2 PIN
O-LALF-W2
Reach Compliance Code
compliant
unknown
Factory Lead Time
26 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AA
DO-34
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.5 W
0.4 W
Reference Voltage-Nom
6.2 V
6.2 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
0.62 mV/°C
0.62 mV/°C
Voltage Tol-Max
4.84%
Base Number Matches
2
1
ECCN Code
EAR99
HTS Code
8541.10.00.50
Operating Temperature-Max
200 °C
Qualification Status
Not Qualified
Working Test Current
7.5 mA
Compare 1N821AE3 with alternatives
Compare 1N821136 with alternatives