1N754D
vs
JAN1N754D-1
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DO-7
|
|
Package Description |
HERMETIC SEALED, GLASS, DO-7, 2 PIN
|
HERMETIC SEALED, GLASS PACKAGE-2
|
Pin Count |
2
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
5 Ω
|
|
JEDEC-95 Code |
DO-204AA
|
DO-35
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
JESD-609 Code |
e0
|
e0
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.417 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Voltage-Nom |
6.8 V
|
6.8 V
|
Reverse Current-Max |
0.1 µA
|
|
Surface Mount |
NO
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Voltage Temp Coeff-Max |
3.604 mV/°C
|
|
Voltage Tol-Max |
1%
|
1%
|
Working Test Current |
20 mA
|
20 mA
|
Base Number Matches |
47
|
1
|
Factory Lead Time |
|
20 Weeks
|
Reference Standard |
|
MIL-19500/127
|
|
|
|
Compare 1N754D with alternatives
Compare JAN1N754D-1 with alternatives