1N6475US vs 1N6475US feature comparison

1N6475US Semtech Corporation

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1N6475US Microchip Technology Inc

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Part Life Cycle Code Transferred Active
Ihs Manufacturer SEMTECH CORP MICROCHIP TECHNOLOGY INC
Package Description HERMETIC SEALED, GLASS PACKAGE-2 HERMETICALLY SEALED, GLASS, D-5C, MELF-2
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code O-LELF-N2 R-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND RECTANGULAR
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology AVALANCHE AVALANCHE
Terminal Form NO LEAD WRAP AROUND
Terminal Position END END
Base Number Matches 5 6
Rohs Code No
Factory Lead Time 21 Weeks
Breakdown Voltage-Min 43 V
Breakdown Voltage-Nom 43.7 V
Case Connection ISOLATED
Clamping Voltage-Max 63.5 V
JESD-609 Code e0
Non-rep Peak Rev Power Dis-Max 1500 W
Power Dissipation-Max 3 W
Rep Pk Reverse Voltage-Max 40.3 V
Terminal Finish TIN LEAD

Compare 1N6475US with alternatives

Compare 1N6475US with alternatives