1N6475US
vs
JAN1N6475US
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
SEMTECH CORP
Package Description
HERMETICALLY SEALED, GLASS, D-5C, MELF-2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
compliant
unknown
Factory Lead Time
21 Weeks
Breakdown Voltage-Min
43 V
43.7 V
Breakdown Voltage-Nom
43.7 V
43.7 V
Case Connection
ISOLATED
ISOLATED
Clamping Voltage-Max
63.5 V
63.5 V
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
TRANS VOLTAGE SUPPRESSOR DIODE
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code
R-LELF-R2
O-LELF-N2
JESD-609 Code
e0
Non-rep Peak Rev Power Dis-Max
1500 W
1500 W
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
RECTANGULAR
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
3 W
3 W
Qualification Status
Not Qualified
Qualified
Rep Pk Reverse Voltage-Max
40.3 V
40.3 V
Surface Mount
YES
YES
Technology
AVALANCHE
AVALANCHE
Terminal Finish
TIN LEAD
Terminal Form
WRAP AROUND
NO LEAD
Terminal Position
END
END
Base Number Matches
5
5
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500/552C
Compare 1N6475US with alternatives
Compare JAN1N6475US with alternatives