1N6351US
vs
JAN1N6351US
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
DEFENSE LOGISTICS AGENCY
|
Package Description |
HERMETIC SEALED, GLASS, B, D-5D, 2 PIN
|
|
Reach Compliance Code |
compliant
|
unknown
|
Factory Lead Time |
28 Weeks
|
|
Additional Feature |
METALLURGICALLY BONDED, HIGH RELIABILITY
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
850 Ω
|
|
JESD-30 Code |
O-LELF-R2
|
O-XELF-R2
|
JESD-609 Code |
e0
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
|
Package Body Material |
GLASS
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Voltage-Nom |
130 V
|
130 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
0.95 mA
|
0.95 mA
|
Base Number Matches |
5
|
1
|
Reference Standard |
|
MIL-19500/533F
|
|
|
|
Compare 1N6351US with alternatives
Compare JAN1N6351US with alternatives