1N5819-1E3
vs
1N5819-AP-HF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICRO COMMERCIAL COMPONENTS CORP
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
O-PALF-W2
Reach Compliance Code
compliant
not_compliant
Factory Lead Time
24 Weeks
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
0.49 V
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-LALF-W2
O-PALF-W2
Non-rep Pk Forward Current-Max
25 A
25 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-65 °C
-55 °C
Output Current-Max
1 A
1 A
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Reference Standard
MIL-STD-750
Rep Pk Reverse Voltage-Max
45 V
40 V
Reverse Current-Max
50 µA
Reverse Test Voltage
45 V
Surface Mount
NO
NO
Technology
SCHOTTKY
SCHOTTKY
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
2
1
ECCN Code
EAR99
HTS Code
8541.10.00.80
Additional Feature
LOW POWER LOSS
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Reverse Recovery Time-Max
0.01 µs
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
5
Compare 1N5819-1E3 with alternatives
Compare 1N5819-AP-HF with alternatives