1N5522B-1E3TR vs CD5522BE3 feature comparison

1N5522B-1E3TR Microsemi Corporation

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CD5522BE3 Microsemi Corporation

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-35
Package Description O-LALF-W2 S-XXUC-N2
Pin Count 2
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-204AH
JESD-30 Code O-LALF-W2 S-XUUC-N1
JESD-609 Code e3
Number of Elements 1 1
Number of Terminals 2 1
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS UNSPECIFIED
Package Shape ROUND SQUARE
Package Style LONG FORM UNCASED CHIP
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Reference Voltage-Nom 4.7 V 4.7 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Finish MATTE TIN
Terminal Form WIRE NO LEAD
Terminal Position AXIAL UPPER
Voltage Tol-Max 5% 5%
Working Test Current 10 mA 10 mA
Base Number Matches 1 1

Compare 1N5522B-1E3TR with alternatives

Compare CD5522BE3 with alternatives