1N5522B-1E3TR
vs
CD5522BE3
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DO-35
Package Description
O-LALF-W2
S-XXUC-N2
Pin Count
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AH
JESD-30 Code
O-LALF-W2
S-XUUC-N1
JESD-609 Code
e3
Number of Elements
1
1
Number of Terminals
2
1
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
SQUARE
Package Style
LONG FORM
UNCASED CHIP
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Reference Voltage-Nom
4.7 V
4.7 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN
Terminal Form
WIRE
NO LEAD
Terminal Position
AXIAL
UPPER
Voltage Tol-Max
5%
5%
Working Test Current
10 mA
10 mA
Base Number Matches
1
1
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Compare CD5522BE3 with alternatives