1N5304TR
vs
1N5304
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
CENTRAL SEMICONDUCTOR CORP
|
VPT COMPONENTS
|
Part Package Code |
DO-35
|
|
Package Description |
HERMETIC SEALED, GLASS PACKAGE-2
|
GLASS PACKAGE-2
|
Pin Count |
2
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.70
|
|
Additional Feature |
HIGH RELIABILITY
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
JEDEC-95 Code |
DO-35
|
DO-7
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
JESD-609 Code |
e0
|
e0
|
Limiting Voltage-Max |
1.75 V
|
1.75 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
200 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Power Dissipation-Max |
0.6 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulation Current-Nom (Ireg) |
1.8 mA
|
1.8 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Surface Mount |
NO
|
NO
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
1
|
24
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Reference Standard |
|
MIL-19500/463
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 1N5304TR with alternatives
Compare 1N5304 with alternatives