1N5304
vs
JAN1N5304
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
VPT COMPONENTS
|
MICROSEMI CORP
|
Package Description |
GLASS PACKAGE-2
|
O-LALF-W2
|
Reach Compliance Code |
compliant
|
not_compliant
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
JEDEC-95 Code |
DO-7
|
DO-204AA
|
JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
JESD-609 Code |
e0
|
e0
|
Limiting Voltage-Max |
1.75 V
|
1.75 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Power Dissipation-Max |
0.5 W
|
0.6 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/463
|
|
Regulation Current-Nom (Ireg) |
1.8 mA
|
1.8 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Surface Mount |
NO
|
NO
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
24
|
6
|
Rohs Code |
|
No
|
Part Package Code |
|
DO-7
|
Pin Count |
|
2
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.70
|
Dynamic Impedance-Min |
|
420000 Ω
|
|
|
|
Compare 1N5304 with alternatives
Compare JAN1N5304 with alternatives