1N5259B-GT3 vs 1N5259BRL feature comparison

1N5259B-GT3 Sangdest Microelectronics (Nanjing) Co Ltd

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1N5259BRL Tak Cheong Electronics (Holdings) Co Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SANGDEST MICROELECTRONICS (NANJING) CO LTD TAK CHEONG ELECTRONICS HOLDINGS CO LTD
Package Description O-LALF-W2 HERMETIC SEALED, GLASS, DO-204AH, 2 PIN
Reach Compliance Code unknown compliant
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-35 DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 39 V 39 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 3.2 mA 3.2 mA
Base Number Matches 2 4
Pbfree Code Yes
Part Package Code DO-204
Pin Count 2
ECCN Code EAR99
HTS Code 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Dynamic Impedance-Max 80 Ω
JESD-609 Code e3
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Peak Reflow Temperature (Cel) 250
Terminal Finish TIN

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