1N5258BD7 vs MX1N5258BTR feature comparison

1N5258BD7 Microsemi Corporation

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MX1N5258BTR Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description O-XALF-W2 O-LALF-W2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-XALF-W2 O-LALF-W2
JESD-609 Code e0 e0
Knee Impedance-Max 700 Ω
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material UNSPECIFIED GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.417 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 36 V 36 V
Reverse Current-Max 0.1 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Temp Coeff-Max 33.48 mV/°C
Voltage Tol-Max 5% 5%
Working Test Current 3.4 mA 20 mA
Base Number Matches 2 2
Part Package Code DO-7
Pin Count 2
JEDEC-95 Code DO-204AA
Moisture Sensitivity Level 1

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Compare MX1N5258BTR with alternatives