1N5258BD7
vs
1N5258BRR1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
TAK CHEONG ELECTRONICS HOLDINGS CO LTD
Package Description
O-XALF-W2
O-LALF-W2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-XALF-W2
O-LALF-W2
JESD-609 Code
e0
Knee Impedance-Max
700 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Operating Temperature-Min
-65 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
36 V
36 V
Reverse Current-Max
0.1 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
33.48 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
3.4 mA
3.4 mA
Base Number Matches
1
2
Part Package Code
DO-204
Pin Count
2
Additional Feature
METALLURGICALLY BONDED
Dynamic Impedance-Max
70 Ω
JEDEC-95 Code
DO-35
Peak Reflow Temperature (Cel)
250
Compare 1N5258BD7 with alternatives
Compare 1N5258BRR1 with alternatives