1N5257C
vs
MSP1N5257C-1TR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
HERMETIC SEALED, GLASS, DO-35, 2 PIN
O-LALF-W2
Reach Compliance Code
compliant
unknown
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-204AH
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.48 W
0.48 W
Reference Voltage-Nom
33 V
33 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
2%
2%
Working Test Current
3.8 mA
20 mA
Base Number Matches
1
1
Part Package Code
DO-35
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Moisture Sensitivity Level
1
Qualification Status
Not Qualified
Compare 1N5257C with alternatives
Compare MSP1N5257C-1TR with alternatives