1N5256B-1 vs TC1N5256B.TB feature comparison

1N5256B-1 Microsemi Corporation

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TC1N5256B.TB Tak Cheong Electronics (Holdings) Co Ltd

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP TAK CHEONG ELECTRONICS HOLDINGS CO LTD
Part Package Code DO-35 DO-35
Package Description HERMETIC SEALED, GLASS, DO-35, 2 PIN O-LALF-W2
Pin Count 2 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 49 Ω 49 Ω
JEDEC-95 Code DO-204AH DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.48 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 30 V 30 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 5%
Working Test Current 4.2 mA 4.2 mA
Base Number Matches 2 1
Peak Reflow Temperature (Cel) 250

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