1N5226B
vs
MSP1N5226D-1
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
RECTRON LTD
MICROSEMI CORP
Part Package Code
DO-35
DO-35
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
O-LALF-W2
Pin Count
2
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Samacsys Manufacturer
Rectron
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
28 Ω
JEDEC-95 Code
DO-35
DO-204AH
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e3
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
265
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.48 W
Qualification Status
Not Qualified
Reference Voltage-Nom
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
10
Voltage Tol-Max
5%
1%
Working Test Current
20 mA
20 mA
Base Number Matches
4
4
Additional Feature
METALLURGICALLY BONDED
Reference Standard
MIL-19500
Compare 1N5226B with alternatives
Compare MSP1N5226D-1 with alternatives