1N4745ARL
vs
BZV85-C16,113
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ONSEMI
NXP SEMICONDUCTORS
Part Package Code
DO-41
DO-4
Package Description
HERMETIC SEALED, GLASS, CASE 59-10, 2 PIN
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
2
Manufacturer Package Code
CASE 59-10
SOD66
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
CAPACITANCE IS CAPTURED FROM THE GRAPH
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
16 Ω
15 Ω
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1 W
1 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
16 V
16 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
15.5 mA
15 mA
Base Number Matches
2
1
Factory Lead Time
4 Weeks
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Reference Standard
CECC50005-010
Reverse Current-Max
0.05 µA
Time@Peak Reflow Temperature-Max (s)
30
Voltage Temp Coeff-Max
15.4 mV/°C
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