1N4482TRLEADFREE
vs
JAN1N4482
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
CENTRAL SEMICONDUCTOR CORP
MICROCHIP TECHNOLOGY INC
Package Description
O-PALF-W2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
60 Ω
JEDEC-95 Code
DO-41
DO-41
JESD-30 Code
O-PALF-W2
O-LALF-W2
JESD-609 Code
e3
e0
Knee Impedance-Max
1100 Ω
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1.5 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
51 V
51 V
Reverse Current-Max
0.05 µA
Reverse Test Voltage
40.8 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Tol-Max
5%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
1
9
Factory Lead Time
28 Weeks
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
Reference Standard
MIL-19500
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