1N4482
vs
1N4482US
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
BKC SEMICONDUCTORS INC
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.50
Samacsys Manufacturer
Microsemi Corporation
Additional Feature
METALLURGICALLY BONDED
HIGH SURGE CAPABILITY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
DO-41
JESD-30 Code
O-LALF-W2
O-LELF-R2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
METAL
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
1.5 W
1.5 W
Reference Voltage-Nom
51 V
51 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WRAP AROUND
Terminal Position
AXIAL
END
Voltage Tol-Max
5%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
48
5
Dynamic Impedance-Max
60 Ω
Qualification Status
Not Qualified
Compare 1N4482 with alternatives
Compare 1N4482US with alternatives