1N3322C vs 1N3323RAE3 feature comparison

1N3322C Microsemi Corporation

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1N3323RAE3 Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-5
Package Description HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN O-MUPM-D1
Pin Count 1
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature PD-CASE PD-CASE
Case Connection ANODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 2.7 Ω
JEDEC-95 Code DO-203AB DO-203AB
JESD-30 Code O-MUPM-D1 O-MUPM-D1
Number of Elements 1 1
Number of Terminals 1 1
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style POST/STUD MOUNT POST/STUD MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 50 W 50 W
Qualification Status Not Qualified
Reference Voltage-Nom 25 V 27 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form SOLDER LUG SOLDER LUG
Terminal Position UPPER UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Tol-Max 2% 10%
Working Test Current 500 mA 460 mA
Base Number Matches 2 1

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