1N3305R vs 1N4563CE3 feature comparison

1N3305R Microsemi Corporation

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1N4563CE3 Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-5 TO-3
Package Description HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN O-MBFM-P2
Pin Count 1 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature PD-CASE
Case Connection CATHODE ANODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 0.2 Ω 0.16 Ω
JEDEC-95 Code DO-203AB TO-204AD
JESD-30 Code O-MUPM-D1 O-MBFM-P2
Knee Impedance-Max 70 Ω
Number of Elements 1 1
Number of Terminals 1 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style POST/STUD MOUNT FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 50 W 50 W
Qualification Status Not Qualified
Reference Voltage-Nom 6.8 V 6.8 V
Reverse Current-Max 300 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form SOLDER LUG PIN/PEG
Terminal Position UPPER BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Temp Coeff-Max 2.72 mV/°C
Voltage Tol-Max 20% 2%
Working Test Current 1850 mA 1850 mA
Base Number Matches 11 1
Pbfree Code Yes
JESD-609 Code e3
Terminal Finish MATTE TIN

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