1N3305R vs 1N3305C feature comparison

1N3305R Motorola Mobility LLC

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1N3305C Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC MICROSEMI CORP
Package Description O-MUPM-D1 HERMETIC SEALED, METAL GLASS, DO-5, 1 PIN
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection CATHODE ANODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 0.2 Ω 0.2 Ω
JESD-30 Code O-MUPM-D1 O-MUPM-D1
Knee Impedance-Max 70 Ω
Number of Elements 1 1
Number of Terminals 1 1
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style POST/STUD MOUNT POST/STUD MOUNT
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 50 W 50 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 6.8 V 6.8 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form SOLDER LUG SOLDER LUG
Terminal Position UPPER UPPER
Voltage Temp Coeff-Max 2.72 mV/°C
Voltage Tol-Max 20% 2%
Working Test Current 1850 mA 1850 mA
Base Number Matches 11 2
Rohs Code No
Part Package Code DO-5
Pin Count 1
Additional Feature PD-CASE
JEDEC-95 Code DO-203AB
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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