1N3064
vs
1N4534
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MICROSEMI CORP
|
| Part Package Code |
DO-35
|
DO-34
|
| Package Description |
DO-35, 2 PIN
|
HERMETIC SEALED, GLASS PACKAGE-2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
unknown
|
unknown
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
DO-35
|
DO-34
|
| JESD-30 Code |
O-XALF-W2
|
O-LALF-W2
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
NOT APPLICABLE
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Output Current-Max |
0.3 A
|
0.15 A
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
NOT APPLICABLE
|
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
75 V
|
75 V
|
| Reverse Recovery Time-Max |
0.004 µs
|
0.004 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE
|
|
| Base Number Matches |
25
|
13
|
| Rohs Code |
|
No
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.70
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Forward Voltage-Max (VF) |
|
0.88 V
|
| Non-rep Pk Forward Current-Max |
|
2 A
|
| Number of Phases |
|
1
|
| Operating Temperature-Max |
|
200 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Reverse Current-Max |
|
0.05 µA
|
|
|
|
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