1N2970C vs UZ7706 feature comparison

1N2970C Microsemi Corporation

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UZ7706 Microsemi Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code DO-4
Package Description HERMETIC SEALED, METAL GLASS, DO-4, 1 PIN
Pin Count 1
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ANODE CATHODE
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-203AA
JESD-30 Code O-MUPM-D1 O-MUPM-X1
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 1 1
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material METAL METAL
Package Shape ROUND ROUND
Package Style POST/STUD MOUNT POST/STUD MOUNT
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 10 W 10 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 6.8 V 6.8 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN LEAD OVER NICKEL TIN LEAD
Terminal Form SOLDER LUG UNSPECIFIED
Terminal Position UPPER UPPER
Voltage Tol-Max 2% 5%
Working Test Current 370 mA 350 mA
Base Number Matches 9 6
Additional Feature METALLURGICALLY BONDED
Dynamic Impedance-Max 0.6 Ω
Reverse Current-Max 1000 µA
Reverse Test Voltage 5.2 V

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