1825093-2
vs
LS308-01GG
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TE CONNECTIVITY LTD
|
ADVANCED INTERCONNECTIONS CORP
|
Reach Compliance Code |
compliant
|
compliant
|
Samacsys Manufacturer |
TE Connectivity
|
|
Contact Configuration |
RECTANGLE
|
RECTANGLE
|
Contact Finish Mating |
NOT SPECIFIED
|
GOLD OVER NICKEL
|
Contact Material |
NOT SPECIFIED
|
BERYLLIUM COPPER
|
Contact Style |
LEAF
|
RND PIN-SKT
|
Device Socket Type |
IC SOCKET
|
IC SOCKET
|
Device Type Used On |
DIP8
|
DIP8
|
Housing Material |
GLASS FILLED THERMOPLASTIC
|
POLYBUTYLENE TEREPHTHALATE
|
Insulation Resistance |
10000000000 Ω
|
|
Mating Contact Pitch |
0.1 inch
|
0.1 inch
|
Mounting Style |
STRAIGHT
|
STRAIGHT
|
Number of Contacts |
8
|
8
|
Operating Temperature-Max |
125 °C
|
140 °C
|
Termination Type |
SOLDER
|
SOLDER
|
Base Number Matches |
2
|
3
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8536.69.40.40
|
Additional Feature |
|
STANDARD: UL 94V-0, LOW PROFILE
|
Body Breadth |
|
0.4 inch
|
Body Depth |
|
0.165 inch
|
Body Length |
|
0.4 inch
|
Contact Finish Termination |
|
Gold (Au) - with Nickel (Ni) barrier
|
JESD-609 Code |
|
e4
|
Operating Temperature-Min |
|
-60 °C
|
PCB Contact Pattern |
|
RECTANGULAR
|
PCB Contact Row Spacing |
|
0.30000000000000004 mm
|
Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare 1825093-2 with alternatives
Compare LS308-01GG with alternatives