10M50DAF672I7G vs 10M50DAF672I7 feature comparison

10M50DAF672I7G Intel Corporation

Buy Now Datasheet

10M50DAF672I7 Intel Corporation

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FBGA-672 27 X 27 MM, 1 MM PITCH, FBGA-672
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3
Number of CLBs 3125
Number of Inputs 500 500
Number of Logic Cells 50000 50000
Number of Outputs 500 500
Number of Terminals 672 672
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 3125 CLBS 3125 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA672,26X26,40 BGA672,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2 mm
Supply Voltage-Max 1.25 V 1.25 V
Supply Voltage-Min 1.15 V 1.15 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 27 mm 27 mm
Base Number Matches 1 3