10H516/BFAJC vs MC10H116FNR2 feature comparison

10H516/BFAJC Freescale Semiconductor

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MC10H116FNR2 Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS ROCHESTER ELECTRONICS LLC
Package Description DFP, FL16,.3 PLASTIC, LCC-20
Reach Compliance Code unknown unknown
JESD-30 Code R-XDFP-F16 S-PQCC-J20
JESD-609 Code e0 e0
Negative Supply Voltage-Nom -5.2 V -5.2 V
Number of Terminals 16 20
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DFP QCCJ
Package Equivalence Code FL16,.3
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK CHIP CARRIER
Power Supplies -5.2 V
Qualification Status Not Qualified COMMERCIAL
Screening Level 38535Q/M;38534H;883B
Supply Current-Max 23 mA
Surface Mount YES YES
Technology ECL10K ECL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form FLAT J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL QUAD
Base Number Matches 3 5
Pbfree Code Yes
Part Package Code QLCC
Pin Count 20
Differential Output YES
Input Characteristics DIFFERENTIAL
Interface IC Type LINE RECEIVER
Interface Standard GENERAL PURPOSE
Length 8.965 mm
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 3
Peak Reflow Temperature (Cel) 240
Receive Delay-Max 1.3 ns
Receiver Number of Bits 3
Seated Height-Max 4.57 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 8.965 mm