10210F vs MC10210P feature comparison

10210F YAGEO Corporation

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MC10210P Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS MOTOROLA INC
Package Description DIP-16 PLASTIC, DIP-16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 3 OUTPUTS EACH FUNCTION 3 OUTPUTS EACH FUNCTION
Family 10K 10K
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Load Capacitance (CL) 3 pF
Logic IC Type OR GATE OR GATE
Number of Functions 2 2
Number of Inputs 3 3
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -30 °C
Output Characteristics OPEN-EMITTER OPEN-EMITTER
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 42 mA 42 mA
Propagation Delay (tpd) 2.8 ns 2.8 ns
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology ECL ECL
Temperature Grade OTHER OTHER
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 4
Rohs Code No
JESD-609 Code e0
Length 19.175 mm
Package Equivalence Code DIP16,.3
Prop. Delay@Nom-Sup 2.8 ns
Schmitt Trigger NO
Seated Height-Max 4.44 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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