10113F
vs
10113F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PHILIPS COMPONENTS
NXP SEMICONDUCTORS
Package Description
,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
STROBED OUTPUTS
STROBED O/P'S
Family
10K
10K
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
Load Capacitance (CL)
3 pF
Logic IC Type
XOR GATE
XOR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-30 °C
-30 °C
Output Characteristics
OPEN-EMITTER
OPEN-EMITTER
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
46 mA
42 mA
Propagation Delay (tpd)
4.2 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
-5.72 V
Supply Voltage-Min (Vsup)
-4.68 V
Supply Voltage-Nom (Vsup)
-5.2 V
Surface Mount
NO
NO
Technology
ECL
ECL
Temperature Grade
OTHER
OTHER
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
JESD-609 Code
e0
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
4.6 ns
Schmitt Trigger
NO
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Compare 10113F with alternatives
Compare 10113F with alternatives