100B111GP300XC100
vs
CDR14BG111DGSS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
KYOCERA AVX COMPONENTS CORP
AVX CORP
Package Description
CHIP
, 1111
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8532.24.00.20
8532.24.00.20
Factory Lead Time
16 Weeks
Capacitance
0.00011 µF
0.00011 µF
Capacitor Type
CERAMIC CAPACITOR
CERAMIC CAPACITOR
Dielectric Material
CERAMIC
CERAMIC
Height
2.59 mm
2.59 mm
JESD-609 Code
e0
e0
Length
2.79 mm
2.79 mm
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Multilayer
Yes
Yes
Negative Tolerance
2%
2%
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Style
SMT
SMT
Positive Tolerance
2%
2%
Rated (AC) Voltage (URac)
212.1 V
Rated (DC) Voltage (URdc)
300 V
300 V
Size Code
1111
1111
Surface Mount
YES
YES
Temperature Characteristics Code
BG
BG
Temperature Coefficient
90+/-20ppm/Cel ppm/°C
90+/-20ppm/Cel ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Tin/Lead (Sn/Pb)
Terminal Shape
WRAPAROUND
WRAPAROUND
Width
2.79 mm
2.79 mm
Base Number Matches
1
1
Packing Method
WAFFLE PACK
Reference Standard
MIL-PRF-55681/4/5
Compare 100B111GP300XC100 with alternatives
Compare CDR14BG111DGSS with alternatives