100364DCQR
vs
100371MW8
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP, DIP24,.4
|
DIE, DIE OR CHIP
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
100K
|
100K
|
| JESD-30 Code |
R-GDIP-T24
|
R-XUUC-N24
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
1
|
3
|
| Number of Inputs |
16
|
4
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
TRUE
|
COMPLEMENTARY
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP24,.4
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Power Supply Current-Max (ICC) |
89 mA
|
80 mA
|
| Prop. Delay@Nom-Sup |
2.1 ns
|
2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.72 mm
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Width |
10.16 mm
|
|
| Base Number Matches |
2
|
3
|
| Propagation Delay (tpd) |
|
1.7 ns
|
| Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare 100364DCQR with alternatives
Compare 100371MW8 with alternatives