100371MW8
vs
100171DCQR
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS LLC
|
Package Description |
DIE, DIE OR CHIP
|
DIP,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
100K
|
100K
|
JESD-30 Code |
R-XUUC-N24
|
R-GDIP-T24
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Number of Functions |
3
|
3
|
Number of Inputs |
4
|
4
|
Number of Outputs |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
UNSPECIFIED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIE
|
DIP
|
Package Equivalence Code |
DIE OR CHIP
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
IN-LINE
|
Power Supply Current-Max (ICC) |
80 mA
|
|
Prop. Delay@Nom-Sup |
2 ns
|
|
Propagation Delay (tpd) |
1.7 ns
|
3 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Surface Mount |
YES
|
NO
|
Technology |
ECL
|
ECL
|
Temperature Grade |
MILITARY
|
OTHER
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
DUAL
|
Base Number Matches |
3
|
3
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
DIP
|
Pin Count |
|
24
|
JESD-609 Code |
|
e0
|
Output Characteristics |
|
OPEN-EMITTER
|
Seated Height-Max |
|
5.72 mm
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
10.16 mm
|
|
|
|
Compare 100371MW8 with alternatives
Compare 100171DCQR with alternatives