100371MW8 vs 100171DCQR feature comparison

100371MW8 National Semiconductor Corporation

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100171DCQR Rochester Electronics LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Package Description DIE, DIE OR CHIP DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 100K 100K
JESD-30 Code R-XUUC-N24 R-GDIP-T24
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 3 3
Number of Inputs 4 4
Number of Outputs 1 1
Number of Terminals 24 24
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIE DIP
Package Equivalence Code DIE OR CHIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Power Supply Current-Max (ICC) 80 mA
Prop. Delay@Nom-Sup 2 ns
Propagation Delay (tpd) 1.7 ns 3 ns
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Surface Mount YES NO
Technology ECL ECL
Temperature Grade MILITARY OTHER
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 3 3
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 24
JESD-609 Code e0
Output Characteristics OPEN-EMITTER
Seated Height-Max 5.72 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 10.16 mm

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